Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same

ABSTRACT

An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an insulating adhesive and ananisotropically electroconductive adhesive for use in, for example,establishing electric connections between circuit boards. Moreparticularly, it relates to an insulating adhesive and ananisotropically electroconductive adhesive curable at low temperatures.

[0003] 2. Description of the Related Art

[0004] In recent years, as countermeasures against the miniaturizationof portable remote terminals such as portable telephones, and a crack ina liquid crystal cell or glass, there has been extensively examined thepractical utilization of a so-called “plastic film liquid crystal”obtained by replacing the glass of the liquid crystal cell with plastic.

[0005] Conventionally, the connection between a liquid crystal panel anda circuit component such as a TCP (Tape Carrier Package) has beenaccomplished by solder, an anisotropically electroconductive adhesivefilm, heat seal, or the like. However, a thermosetting anisotropicallyelectroconductive adhesive film has been mainstream in response to thetrend toward a smaller pitch and a narrower frame, and from theviewpoints of high adhesion and high reliability. Thus, the plastic filmliquid crystal is also required to be connected by the anisotropicallyelectroconductive adhesive film.

[0006] The anisotropically electroconductive adhesive film is originallydesigned under the assumption that the connection between glass and TCP,or the like is established by compression bonding connection at hightemperatures and high pressures, for a short time. In a common case, theconnection is established, for example, at a temperature of 170° C. forabout 20 seconds. Even in the case for a low-temperature connection, itis established at a temperature of 150° C. for around 20 seconds.

[0007] However, the plastic film liquid crystal which is a material tobe joined is manufactured by laminating an organic material of aprotective layer or the like on mainly polyether sulphone orpolycarbonate. Therefore, at the compression bonding temperaturesthereof, the film may undergo thermal deformation which will not occurwith glass, or cracks occur in ITO (Indium Tin Oxide) electrodes,thereby causing a display failure.

[0008] For these reasons, the anisotropically electroconductive adhesivefilm for connecting the plastic film liquid crystal is required to havethe characteristics of establishing the connection at 140° C. or less,and under low pressures. However, in actuality, among the existinganisotropically electroconductive adhesive films, there is almost no onewhich is connectable at 140° C. or less, and even the one connectable at140° C. or less has a low reliability.

[0009] Heretofore, the thermosetting anisotropically electroconductiveadhesive films which can provide high reliability include various epoxyresins as main components, and there have been dominant the onesobtained by adding a so-called latent curing agent prepared bymicro-capsulating or blocking an amine-based or imidazole-based curingagent, Lewis acid, or other curing agent thereto, and processing andforming the mixture into a film.

[0010] Alternatively, there are also other films obtained by addingvarious resins such as thermosetting elastomers and thermoplasticelastomers, thermosetting resins, thermoplastic resins, tackifiers,fillers, and coupling agents thereto for the purpose of improvingvarious characteristics such as adhesion, moisture resistance, andstickiness.

[0011] However, for the conventional anisotropically electroconductiveadhesive films using such curing agents, since a compression bondingtemperature of 150° C. or more is required for breaking or melting ofthe microcapsules, or for dissociation of the blocking agents, theforegoing requirements cannot be satisfied. Whereas, for the curingagents connectable at 150° C. or less, since the usable time length ofthe anisotropically electroconductive adhesive film (film life) isshort, it is difficult to use the film in actual manufacturing thereof.

[0012] On the other hand, as the anisotropically electroconductiveadhesive films which do not contain epoxy resins as main components,there is proposed one of the radical polymerization type obtained byeffecting polymerization with an unsaturated bond catalyst (JapanesePatent Laid-Open Publication No.Sho 61-276873) by the applicant of thepresent invention, and the like. However, there has not been yetdeveloped any anisotropically electroconductive adhesive film whichsatisfies the requirements of low-temperature curability, high adhesion,high reliability, and the like.

SUMMARY OF THE INVENTION

[0013] The present invention has been achieved for solving such problemsin the prior art. It is therefore an object of the present invention toprovide an insulating adhesive film and an anisotropicallyelectroconductive adhesive film which satisfy requirements oflow-temperature curability, high adhesion, and high reliability.

[0014] The present inventors have conducted an intensive study thereonin order to solve the foregoing problems. As a result, they have foundthe following fact. That is, an adhesive which is curable at lowtemperatures, and has high adhesion and reliability can be obtained bymixing a radical polymerizable resin component having an unsaturateddouble bond, a resin component having no unsaturated double bond, and aphosphoric acid-containing resin component. Thus, they have completedthe present invention.

[0015] A first aspect of the present invention achieved based on such adiscovery pertains to a low-temperature setting adhesive characterizedby containing as main components, a radical polymerizable resincomponent having an unsaturated double bond, a resin component having nounsaturated double bond, a phosphoric acid-containing resin component,and a radical polymerization initiator.

[0016] In accordance with a second aspect of the present invention, itis also effective that a phosphate-based coupling agent is further mixedtherein in the first aspect of the present invention.

[0017] Further, in accordance with a third aspect of the presentinvention, it is also effective that the phosphoric acid-containingresin component has a radical polymerizable reactive group of thepresent invention.

[0018] Whereas, a fourth aspect of the present invention pertains to ananisotropically electroconductive adhesive characterized in thatelectroconductive particles are dispersed in the low-temperature settingadhesive according to the present invention.

[0019] In accordance with a fifth aspect of the present invention, it isalso effective that the electroconductive particle comprises a resinparticle which is deformed when applied with pressure as a nucleus, andan electroconductive metal thin layer provided on a surface layerportion thereof according to the present invention.

[0020] Further, in accordance with a sixth aspect of the presentinvention, it is also effective that an insulating layer is provided onthe metal thin layer of the electroconductive particle of the presentinvention.

[0021] On the other hand, a seventh aspect of the present inventionpertains to an insulating adhesive film characterized by including apeeling sheet, and the above mentioned low-temperature setting adhesive,the adhesive being provided on the peeling sheet by coating and drying.

[0022] An eighth aspect of the present invention pertains to ananisotropically electroconductive adhesive film characterized byincluding a peeling sheet, and the above mentioned anisotropicallyelectroconductive adhesive, the adhesive being provided on the peelingsheet by coating and drying.

[0023] In the present invention having the foregoing structure, the highadhesion based on the large polarity of the phosphoric acid can beobtained by the reaction between the radical polymerizable resincomponent having an unsaturated double bond and the phosphoricacid-containing resin component upon thermo compression bonding.

[0024] Consequently, according to the present invention, even whencuring is effected at low temperatures, a desired initial adhesion forcecan be obtained, thereby ensuring the connection between electrodeswhile maintaining the deformed state thereof during compression bonding.Therefore, it becomes possible to improve the continuity resistance andthe continuity reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025]FIG. 1(a) is a view illustrating the configuration showing thestate prior to the thermo compression bonding of a preferred embodimentof an anisotropically electroconductive adhesive film in accordance withthe present invention; and

[0026]FIG. 1(b) is a view illustrating the configuration showing thestate posterior to the thermo compression bonding of the preferredembodiment of an anisotropically electroconductive adhesive film inaccordance with the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIEMENTS

[0027] Below, preferred embodiments of the present invention will bedescribed in details with reference to the drawings.

[0028] The present invention is applicable for both of theanisotropically electroconductive adhesive having electroconductiveparticles and the insulating adhesive having no electroconductiveparticle. Further, either liquid or film-like adhesive is acceptable. Ineach embodiment of the present invention, a description will be given toa film-like anisotropically electroconductive adhesive as an example.

[0029] Referring now to FIGS. 1(a) and 1(b), an anisotropicallyelectroconductive adhesive film 1 of the present invention is used forthe connection of ITO electrodes 3 formed on a resin film 2 withterminals 5 of a circuit board 4 such as the TCP or FPC (FlexiblePrinted Circuit), or connection thereof with bumps formed on an LSI chipnot shown. It is so configured that electroconductive particles 7 aredispersed in a film-like insulating adhesive resin 6 formed on a peelingsheet 8.

[0030] In the present invention, the insulating adhesive resin 6contains, as main components, a radical polymerizable resin componenthaving an unsaturated double bond, a resin component having nounsaturated double bond, a phosphoric acid-containing resin component,and a radical polymerization initiator.

[0031] Here, examples of the radical polymerizable resin componenthaving an unsaturated double bond include (meth)acrylate resins eachhaving at least one or more (meth)acryloyl groups in one molecule andmodified products thereof, unsaturated polyester diallyl phthalateresins, vinyl ester resins, bismaleimide resins, and the like, andmodified products thereof, and various monomers for viscosityadjustment.

[0032] Out of these, the cured product of epoxy acrylate represented bythe following chemical formula is particularly preferred in terms ofchemical resistance, toughness, and adhesion.

[0033] Examples of the resin component having no unsaturated double bondinclude phenoxy resins and modified products thereof, urethane resinsand modified products thereof, acrylic rubbers and modified productsthereof, polyvinyl butyral and polyvinyl acetal, and modified productsthereof, cellulose derivatives and modified products thereof, polyolresins and modified products thereof, rubber-like resins such aspolystyrene-polyisoprene-polystyrene (SIS),polystyrene-polybutadiene-polystyrene (SBS),polystyrene-poly(ethylene-butylene)-polystyrene (SEBS), andpolystyrene-poly(ethylene-propylene)-polystyrene (SEPS), and modifiedproducts thereof.

[0034] Out of these, the phenoxy resin represented by the followingchemical formula is particularly preferred in terms of chemicalresistance and toughness.

[0035] On the other hand, examples of the phosphoric acid-containingresin component include phosphoric acid-containing (meth)acrylate andphosphorus-containing polyester resins.

[0036] Out of these, the one having a radical polymerizable reactivegroup is preferably used from the viewpoint of improving the heatresistance, chemical resistance, and the like.

[0037] For example, the phosphoric acid acrylate (acryloyloxyester-ashed phosphate) represented by the following chemical formula canbe preferably used.

[0038] [where n is 0 to 1 in terms of a mean value, and a and b areabout 1.5 in terms of a mean value.]

[0039] Further, as the radical polymerization initiator, in addition toorganic peroxides represented by the following chemical formula:

[0040] a light initiator can also be used.

[0041] Further, a curing promoter, a supplement accelerator, and apolymerization inhibitor can also appropriately be added to theinitiators. Furthermore, latency can also be imparted to the radicalpolymerization initiators and the like by capsulation or blockingthereof.

[0042] Still further, various coupling agents can also be added to theinsulating adhesive resin 6 of the present invention.

[0043] For example, the vinylsilane coupling agent represented by thefollowing chemical formula:

[0044] and phosphate-based coupling agents can be preferably used.

[0045] In particular, the phosphate-based coupling agents can bepreferably used from the viewpoint of improving the adhesion.

[0046] In the present invention, for more effectively attaining theforegoing object, the mixing ratio of a radical polymerizable resincomponent having an unsaturated double bond, a resin component having nounsaturated double bond, and a phosphoric acid-containing resincomponent relative to the insulating adhesive resin 6 is preferably 15to 85% by weight for the radical polymerizable resin component having anunsaturated double bond, 30 to 90% by weight for the resin componenthaving no unsaturated double bond, and 0.01 to 20% by weight for thephosphoric acid-containing resin component. It is more preferably 30 to70% by weight for the radical polymerizable resin component having anunsaturated double bond, 30 to 80% by weight for the resin componenthaving no unsaturated double bond, and 0.05 to 10% by weight for thephosphoric acid-containing resin component.

[0047] On the other hand, in the present invention, as the peeling sheet8, the one made of a fluorine-containing resin such aspolytetrafluoroethylene resin (PTFE), or the one made of anon-silicone-containing material (ex., polypropylene) is preferably usedfrom the viewpoint of facilitating the peeling of the peeling sheet 8from the adhesive film, and from the viewpoint of allowing thecharacteristics (adhesion, moisture resistance, and the like) inherentin the adhesive to be sufficiently exhibited.

[0048] On the other hand, in the present invention, as theelectroconductive particles 7, there are also used metal particles, andthe one obtained by providing a metal thin layer having oxidationresistance such as gold (Au) plate on the surface of the metal particle.However, from the viewpoint of ensuring good electric connection, thereis preferably used the one including resin particles which will bedeformed under pressure as a nucleus, and an electroconductive metalthin layer provided on the surface layer portion thereof.

[0049] Further, from the viewpoint of ensuring the insulation propertiesamong the electroconductive particles 7, there is preferably used theone obtained by covering the surface of the metal thin layer of theelectroconductive particle 7 with an insulating layer.

[0050] Further, the low-temperature setting adhesive of the presentinvention and the anisotropically electroconductive adhesive film usingthe same can be manufactured by a conventional method.

[0051] Namely, electroconductive particles are dispersed in a bindersolution prepared by dissolving the radical polymerizable resin, and thelike in an appropriate solvent. The resulting paste is applied onto thepeeling sheet, and the solvent is then vaporized by heating or the like,resulting in the objective anisotropically electroconductive adhesivefilm.

EXAMPLES

[0052] Below, examples of the anisotropically electroconductive adhesivefilm in accordance with the present invention will be described indetails together with comparative examples.

Example 1

[0053] A solution obtained by mixing respective components at thefollowing ratio was applied onto a PTFE film with a thickness of 50 μm.The solvent was then vaporized so that the residual solvent was in anamount of 1% or less to obtain an anisotropically electroconductiveadhesive film with a thickness of 15 μm.

[0054] Incidentally, each component in a solid state out of thefollowing resins was mixed therein while being appropriately dissolvedby a solvent, methyl ethyl ketone (MEK).

[0055] Liquid epoxy acrylate (manufactured by Kyoeisya Chemical Co.,Ltd., 3002A) 25 wt %

[0056] Solid epoxy acrylate (manufactured by Showa Highpolymer Co.,Ltd., −60) 25 wt %

[0057] Phenoxy resin (manufactured by Tohto Kasei Co., Ltd., YP50) 40 wt%

[0058] Phosphoric acid acrylate (manufactured by Nippon Kayaku Co.,Ltd., PM2) 4 wt %

[0059] Vinylsilane coupling agent (peroxyketal manufactured by NipponOil & Fats Corp., Perhexa 3M)₃ wt %

[0060] Electroconductive particle (manufactured by Sony Chemicals Corp.,Ni/Au-plated acrylic resin particle) 3 wt % TABLE 1 Composition ratio ofExamples and Comparative Examples Phosphate- Phosphoric acid Vinylsilanebased Organic Epoxy Phenoxy acrylate coupling coupling peroxide Electro-acrylate resin RDX agent agent Perhexa conductive 3002A VR-60 YP50 PM263182 A172 KR38S 3M particle Example 1 25 25 40 3 — 1 — 3 3 Example 2 2525 40 — 3 1 — 3 3 Example 3 25 25 40 0.1 — 1 — 3 3 Comparative — 25 2073 — 1 — 3 3 Example 1 Example 4 25 25 40 3 — — 1 3 3 Comparative 25 2543 — — 1 — 3 3 Example 2

Example 2

[0061] An anisotropically electroconductive adhesive film wasmanufactured in the same manner as in Example 1, except that the amountof a different type of phosphoric acid acrylate (manufactured by DaicelChemical Industries, Ltd., RDX63182) to be added was 3% by weight.

Example 3

[0062] An anisotropically electroconductive adhesive film wasmanufactured in the same manner as in Example 1, except that the amountof phosphoric acid acrylate (manufactured by Nippon Kayaku Co., Ltd.,PM2) to be added was 0.1% by weight.

Example 4

[0063] An anisotropically electroconductive adhesive film wasmanufactured in the same manner as in Example 1, except that thephosphate-based coupling agent (manufactured by Ajinomoto Co., Inc.,KR38S) was added in an amount of 1% by weight in place of thevinylsilane coupling agent (manufactured by Nippon Oil & Fats Corp.,Perhexa 3M) as the coupling agent.

Comparative Example 1

[0064] An anisotropically electroconductive adhesive film wasmanufactured in the same manner as in Example 1, except that epoxyacrylate was not added, the amount of phenoxy resin to be added was 20%by weight, and the amount of phosphoric acid acrylate to be added was73% by weight.

Comparative Example 2

[0065] All anisotropically electroconductive adhesive film wasmanufactured in the same manner as in Example 1, except that the amountof phenoxy resin to be added was 43% by weight, and phosphoric acidacrylate was not added. TABLE 2 Evaluation results of Examples andComparative Examples Adhesive Continuity strength (gf/cm) resistance (Ω)60° C. 95% 60° C. 95% Initial after 500 hr Initial after 500 hr Example1 865 780 9.6 10.3 Example 2 680 630 9.4 11.1 Example 3 580 250 9 12Comparative 330 280 9.8 14 Example 1 Example 4 525 520 9.5 11.4Comparative 230 220 9.8 12.4 Example 2

[0066] (Evaluation)

[0067] [Adhesive Strength]

[0068] Using each anisotropically electroconductive adhesive film (width2 mm) of Examples and Comparative Examples described above, a plasticliquid crystal panel with a pitch of 200 μm and a flexible printed boardwere compression bonded under the conditions shown in Table 2, resultingin a sample for evaluating the adhesive strength.

[0069] The flexible printed board herein used was a so-called two-layerflexible printed board in which no adhesive layer was present betweenthe base made of polyimide and the conductor made of copper. As theconductor, the one with a thickness of 12 μm was used.

[0070] Then, measurements were carried out for the adhesive strengths ofinitial state immediately after thermo compression bonding, and afterconducting a wet-heat resistance reliability test under the conditionsof a temperature of 60° C., a relative humidity of 95%, and for 500hours, respectively. The results are shown in Table 2.

[0071] [Continuity Resistance]

[0072] Using an ITO substrate not subjected to etching, a flexibleprinted board, and each anisotropically electroconductive adhesive film,measurements were carried out for the continuity resistances of initialstate immediately after thermo compression boding and after the wet-heatresistance reliability test in accordance with the four-terminal method(JIS C 5012). The results are shown in Table 2.

[0073] As shown in Table 2, for the anisotropically electroconductiveadhesive films of Examples 1 to 4, good results were obtained in all ofadhesion strength and continuity resistance.

[0074] On the other hand, for the anisotropically electroconductiveadhesive film containing no epoxy acrylate of Comparative Example 1, andthe one containing no phosphoric acid component of Comparative Example2, the adhesive strengths were not good.

[0075] [Peelability of Peeling Sheet]

[0076] On the other hand, the anisotropically electroconductive adhesivefilms of Example 1 described above were formed on a peeling sheetobtained by coating a silicone resin on a PET film, and a peeling sheetmade of PTFE, respectively.

[0077] Then, a sample plate was stuck through an adhesive tape on thesurface of each anisotropically electroconductive adhesive film,resulting in a sample for evaluating the peelability. For each samplefor evaluating the peelability, the peeling sheet was pulled off in adirection at right angles thereto to determine the strength per 5-cmwidth as the peel force. In this case, measurements were carried out forthe peel force (initial peel force) immediately after thermo compressionbonding, and the peel force after allowing the sample to stand for 1month under the condition of a temperature of 23′ (ordinarytemperature). The results are shown in Table 3.

[0078] Further, for each sample for evaluating the peelability,measurements were carried out for the adhesive strength immediatelyafter thermo compression bonding, and the adhesive strength afterallowing the sample to stand for 1 month under the condition of atemperature of 23° C. The results are shown in Table 3. TABLE 3Peelability and adhesive strength according to the peeling sheet typePeel force (gf/5 cm) Adhesive strength (gf/cm) 23° C. after 23° C. afterInitial 1 month Initial 1 month PTFE 30˜40 30˜40 865 855 PET silicone20˜30 150˜200 780 310 peeling treatment

[0079] As shown in Table 3, for the one using the peeling sheet made ofPTFE, good results were obtained in peelability and adhesive strength.

[0080] On the other hand, for the one using a peeling sheet obtained bycoating a silicone resin on a PET film, the peel force increased, andthe sheet becomes difficult to peel and the adhesive strength was alsoreduced, after a lapse of about one month at ordinary temperature.

[0081] It is conceivable that this is attributable to the followingfact. That is, the silicone slightly transfers to the surface of theadhesive because of the high affinity between silicone and the adhesivecomponent, resulting in deterioration in characteristics such asadhesive strength and moisture resistance.

[0082] As described above, the present invention can provide aninsulating adhesive film and an anisotropically electroconductiveadhesive film which satisfy requirements of low-temperature curability,high adhesion, and high reliability.

[0083] While there has been described what are at present considered tobe preferred embodiments of the present invention, it will be understoodthat various modifications may be made thereto, and it is intended thatthe appended claims cover all such modifications as fall within the truespirit and scope of the invention.

What is claimed is:
 1. A low-temperature setting adhesive, comprising asmain components: a cured product of an epoxy acrylate represented by thefollowing formula:

a resin component having no unsaturated double bond; abis(methacryloyloxyethyl) hydrogen phosphate; and a radicalpolymerization initiator, wherein the epoxy acrylate is present in theamount of 15-85% by weight of adhesive, the resin component having nounsaturated double bond is present in the amount of 30 to 90% by weightof the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate ispresent in the amount of 0.01 to 20% by weight of the adhesive, andwherein n has a value in the range from 0-6.
 2. The low-temperaturesetting adhesive according to claim 1, wherein a phosphate-basedcoupling agent is further mixed therein.
 3. The low-temperature settingadhesive according to claim 1, wherein said phosphoric acid-containingresin has a radical polymerizable reactive group.
 4. The low-temperaturesetting adhesive according to claim 2, wherein said phosphoricacid-containing resin component has a radical polymerizable reactivegroup.
 5. An anisotropically electroconductive adhesive, comprising: alow-temperature setting adhesive, comprising as main components: a curedproduct of an epoxy acrylate represented by the following formula:

a resin component having no unsaturated double bond,bis(methacryloyloxyethyl) hydrogen phosphate, a radical polymerizationinitiator; and an electroconductive particle being dispersed in saidlow-temperature setting adhesive, wherein the epoxy acrylate is presentin the amount of 15-85% by weight of adhesive, the resin componenthaving no unsaturated double bond is present in the amount of 30 to 90%by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogenphosphate is present in the amount of 0.01 to 20% by weight of theadhesive, and wherein n has a value in the range from 0-6.
 6. Theanisotropically electroconductive adhesive according to claim 5, whereina phosphate-based coupling agent is further mixed in saidlow-temperature setting adhesive.
 7. The anisotropicallyelectroconductive adhesive according to claim 5, wherein said phosphoricacid-containing resin has a radical polymerizable reactive group.
 8. Theanisotropically electroconductive adhesive according to claim 6, whereinsaid phosphoric acid-containing resin component has a radicalpolymerizable reactive group.
 9. The anisotropically electroconductiveadhesive according to claim 5, wherein said electroconductive particlecomprises a resin particle which is deformed when applied with pressureas a nucleus, and an electroconductive metal thin layer provided on asurface layer portion thereof.
 10. The anisotropically electroconductiveadhesive according to claim 6, wherein said electroconductive particlecomprises a resin particle which is deformed when applied with pressureas a nucleus, and an electroconductive metal thin layer provided on asurface layer portion thereof.
 11. The anisotropically electroconductiveadhesive according to claim 7, wherein said electroconductive particlecomprises a resin particle which is deformed when applied with pressureas a nucleus, and an electroconductive metal thin layer provided on asurface layer portion thereof.
 12. The anisotropically electroconductiveadhesive according to claim 8, wherein said electroconductive particlecomprises a resin particle which is deformed when applied with pressureas a nucleus, and an electroconductive metal thin layer provided on asurface layer portion thereof.
 13. The anisotropically electroconductiveadhesive according to claim 9, wherein an insulating layer is providedon said metal thin layer of said electroconductive particle.
 14. Theanisotropically electroconductive adhesive according to claim 10,wherein an insulating layer is provided on said metal thin layer of saidelectroconductive particle.
 15. The anisotropically electroconductiveadhesive according to claim 11, wherein an insulating layer is providedon said metal thin layer of said electroconductive particle.
 16. Theanisotropically electroconductive adhesive according to claim 12,wherein an insulating layer is provided on said metal thin layer of saidelectroconductive particle.
 17. An insulating adhesive film, comprising:a peeling sheet; and a low-temperature setting adhesive, said adhesivebeing provided on said sheet by coating and drying, and comprising asmain components: a cured product of an epoxy acrylate represented by thefollowing formula:

a resin component having no unsaturated double bond, an acryloyloxyester-ashed phosphate, and a radical polymerization initiator.
 18. Theinsulating adhesive film according to claim 17, wherein aphosphate-based coupling agent is further mixed therein.
 19. Theinsulating adhesive film according to claim 17, wherein said phosphoricacid-containing resin component has a radical polymerizable reactivegroup.
 20. The insulating adhesive film according to claim 18, whereinsaid phosphoric acid-containing resin component has a radicalpolymerizable reactive group.
 21. An anisotropically electroconductiveadhesive film, comprising: a peeling sheet; a low-temperature settingadhesive provided on said sheet by coating and drying, and comprising asmain components: a cured product of an epoxy acrylate represented by thefollowing formula:

a resin component having no unsaturated double bond, an acryloyloxyester-ashed phosphate, and a radical polymerization initiator; and anelectroconductive particle dispersed in said low-temperature settingadhesive.
 22. The anisotropically electroconductive adhesive filmaccording to claim 21, wherein a phosphate-based coupling agent isfurther mixed in said low-temperature setting adhesive.
 23. Theanisotropically electroconductive adhesive film according to claim 21,wherein said phosphoric acid-containing resin component has a racdicalpolymerizable reactive group.
 24. The anisotropically electroconductiveadhesive film according to claim 22, wherein said phosphoricacid-containing resin component has a radical polymerizable reactivegroup.
 25. The anisotropically electroconductive adhesive film accordingto claim 21, wherein said electroconductive particle comprises a resinparticle which is deformed when applied with pressure as a nucleus, andan electroconductive metal thin layer provided on a surface layerportion thereof.
 26. The anisotropically electroconductive adhesive filmaccording to claim 22, wherein said electroconductive particle comprisesa resin particle which is deformed when applied with pressure as anucleus, and an electroconductive metal thin layer provided on a surfacelayer portion thereof.
 27. The anisotropically electroconductiveadhesive film according to claim 23, wherein said electroconductiveparticle comprises a resin particle which is deformed when applied withpressure as a nucleus, and an electroconductive metal thin layerprovided on a surface layer portion thereof.
 28. The anisotropicallyelectroconductive adhesive film according to claim 24, wherein saidelectroconductive particle comprises a resin particle which is deformedwhen applied with pressure as a nucleus, and an electroconductive metalthin layer provided on a surface layer portion thereof.
 29. Theanisotropically electroconductive adhesive film according to claim 25,wherein an insulating layer is provided on said metal thin layer of saidelectroconductive particle.
 30. The anisotropically electroconductiveadhesive film according to claim 26, wherein an insulating layer isprovided on said metal thin layer of said electroconductive particle.31. The anisotropically electroconductive adhesive film according toclaim 27, wherein an insulating layer is provided on said metal thinlayer of said electroconductive particle.
 32. The anisotropicallyelectroconductive adhesive film according to claim 28, wherein aninsulating layer is provided on said metal thin layer of saidelectroconductive particle.
 33. The low-temperature setting adhesiveaccording to claim 1, wherein the resin component having no unsaturateddouble bond is present in the amount of 30-80% by weight of theadhesive.
 34. The anisotropicallly electroconductive adhesive accordingto claim 5, wherein the resin component having no unsaturated doublebond is present in the amount of 30-80% by weight of the adhesive.